NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, recently announced the formation of a new Institute Node in Missouri aimed to increase the volume, pace and coordination of FHE development.
“We see Missouri as a key gateway to the Midwest, an important area of the country to involve in national FHE development,” said Malcolm Thompson, Executive Director of NextFlex. “Through support of Missouri-based educators and companies, this Node will become a key player in securing interest, facilities and workforce to further develop the U.S.’s growing advanced manufacturing industry and to spearhead domestic electronics innovation.”
The NextFlex Missouri Node, led by the Jordan Valley Innovation Center at Missouri State University, is designed to foster collaboration and benefit NextFlex members by providing access to facilities, equipment and infrastructure to fast-track FHE design, development and manufacturing adoption.
“The Jordan Valley Innovation Center is leading force in technology development focused on collaborative cutting edge R&D in nanotechnology, bio-materials, and other advanced technologies including semiconductor packaging,” said Matthew Curry, Director of the Center for Applied Science and Engineering, Jordan Valley Innovation Center. “Being part of the NextFlex national network greatly enhances our ability to attract new capabilities and partners to JVIC. We are pleased to be part of this exciting technology community and bring emphasis to technology opportunities in Missouri.”
Priority technology areas of focus for the NextFlex Missouri Node include advanced semiconductor packaging, flexible electronics, environmental sensors, and automotive and defense applications.